Patents and Patent Applications

  1. “Voltage Controlled Oscillator Utilizing Threshold Voltage Control of Silicon-On-Insulator MOSFETs,” U.S. Patent 6,133,799, 2000.
  2. “Silicon-On-Insulator Body-Contacted Dynamic Memory,” U.S. Patent 6,111,778, 2000.  This patent was part of patent licensing agreement between IBM and both Sony and Toshiba and was discussed in the EE Times article entitled “Toshiba’s DRAM Cell piggybacks on SOI Wafer”.
  3. “Clock Multiplexer for Dynamic Frequency Scaling,” U.S. Patent #6,886,106 2005.
  4. “Push-Pull Amplifier for use in Generating a Reference Voltage” U.S. Patent Application 09/734,373.
  5. “An Algorithm for Calculating the Redundancy Allocation for a Memory with Multi-Dimensional Redundancy” U.S. Patent Application 10/668,651.  Central IP during the acquisition of PDAT Technologies (my start-up) by Magma Design Automation, Inc.   Subsequently, Synopsys acquired Magma and elected to not pursue full patenting.
  6. At least five patent applications underway focusing on different aspects of using 3D printing to fabricate electronics.

 

Journal Articles

  1. Roberson D, Wicker R, MacDonald E. Ohmic Curing of 3D Printed Silver Interconnects for Structural Electronics. ASME Journal of Electronic Packaging. 2015
  2. M. Liang, C Shemelya, E. MacDonald, R. Wicker, H. Xin, “3D Printed Microwave Patch Antenna via Fused Deposition Method and Ultrasonic Wire Mesh Embedding Technique”, IEEE Antennas and Wireless Propagation Letters, Issue 99, 2015.
  3. S. Gaytan, M. Cadena, H. Karim, D. Delfin, Y. Lin, D. Espalin, E. MacDonald, R.B. Wicker, “Fabrication of barium titanate by binder jetting additive manufacturing technology”, Ceramics International, Elsevier, 2015.
  4. C. Shemelya, A. Rivera, A. Torrado Perez,  C. Rocha, M. Liang, X. Yu, C. Kief, D. Alexander, J. Stegeman, H. Xin, R. Wicker, E. MacDonald, D. Roberson, “Mechanical, Electromagnetic, and X-Ray Shielding Characterization of a 3D Printable Tungsten/Polycarbonate Polymer Matrix Composite for Space Based Applications,” Journal of Electronic Materials, 2014.
  5. C. Shemelya, F. Cedillos, E. Aguillera, D. Muse, D. Espalin, R. Wicker, E. MacDonald “”Encapsulated Copper Wire and Copper Mesh Capacitive Sensing for 3D Printing Applications,” IEEE Sensors Journal, Vol. 15. Iss. 2, 2015.
  6. D. Espalin, D. Muse, F. Medina, E. MacDonald, and R.B. Wicker, “3D Printing Multi-Functionality: Structures with Electronics,” International Journal of Advanced Manufacturing Technology, Volume 72, Issue 5-8, pp. 963-978, 2014.
  7. A. J. Lopes, I. H. Lee, E. MacDonald1, R. Quintana, and R. Wicker, “Laser Curing of Silver-Based Conductive Inks for In Situ 3D Structural Electronics Fabrication in Stereolithography”, Journal Materials Processing Technology, Volume 214, Issue 9, pp. 1935-1945, 2014.
  8. E. MacDonald; R. Salas; D. Espalin; M. Perez; E. Aguilera; D. Muse; R. Wicker, “3D Printing for the Rapid Prototyping of Structural Electronics,” Access IEEE, Vol. 2, 2014.
  9. J. Mireles, H.C. Kim, I.H. Lee, D. Espalin, F. Medina, E. MacDonald, and R.B. Wicker, “Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys,” Journal of Electronic Packaging, 2012.
  10. D.A. Roberson, R.B. Wicker, and E. MacDonald, “Ohmic Curing of Printed Silver Conductive Traces,” Journal of Electronic Materials, Volume 41, Issue 9, pp. 2553-2566 2012.
  11. R.B. Wicker and E.W. MacDonald, “Multi-Material, Multi-Technology Stereolithography,” Virtual and Physical Prototyping, Volume 7, Number 3, pages 181-194, 2012.
  12. D.A. Roberson, R.B. Wicker, and E. MacDonald, “Microstructural Characterization of Electrically Failed Conductive Traces Printed from Ag Nanoparticle Inks,” Materials Letters, Volume 76, pp. 51-54, 2012.
  13. A. Chavan, P. Palakurthi, E. MacDonald, J. Neff, E. Bozeman, “Heavy Ion Characterization of a Radiation Hardened Flip-Flop Optimized for Subthreshold Operation,” Journal of Low Power Electronics and Applications, March 2012.
  14. A. Lopes, E. MacDonald, and R.B. Wicker, “Integrating Stereolithography and Direct Print Technologies for 3D Structural Electronics Fabrication,” Rapid Prototyping Journal, Volume 18, Issue 2, 2012, pages 129-143.

A seminal piece in the use of 3D Printing to fabricate electronics.  Paper was chosen as an Outstanding Paper Award Winner at the Literati Network Awards for Excellence 2013.

  1. M.D. Irwin, D. A. Roberson, R. I. Olivas, R. B. Wicker, and E. MacDonald, ”Conductive Polymer-Coated Threads as Electrical Interconnects in E-Textiles”, Journal of Intelligence Community Research and Development, permanently available on Intelink, 2012.
  2. M.D. Irwin, D.A. Roberson, R.I. Olivas, R.B. Wicker and E. MacDonald, “Conductive Polymer-Coated Threads as Electrical Interconnects in e-Textiles,” Fibers and Polymers, Volume 12, Number 7, 2011, pages 904-910, 2011.
  3. D.A. Roberson, R.B. Wicker, L.E. Murr, K. Church, and E. MacDonald, “Microstructural and Process Characterization of Conductive Traces Printed from Ag Particulate Inks,” Materials Letters, Volume 4, Issue 6, pages 963-979, 2011.
  4. D.A. Roberson, E. MacDonald, K. Church, and R.B. Wicker, “Failure Investigation of Direct Write Pen Tips,” Journal of Failure Analysis and Prevention, Volume 10, Number 6, pages 504-507, 2010.
  5. H. Kim, J.W. Choi, E. MacDonald, and R.B. Wicker, “Slice Overlap Detection Algorithm for Process Planning in Multiple Material Stereolithography,” International Journal of Advanced Manufacturing Technology, Volume 46, Issue 9, pp. 1161-1170, 2010.
  6. J.W. Choi, E. MacDonald, R.B. Wicker, “Multi-Material Micro-stereolithography,” International Journal of Advanced Manufacturing Technology, Volume 49, Issue 5, pages 543-551, 2010.
  7. E. MacDonald, N. Touba, “Delay Testing of Partially-Depleted Silicon-On-Insulator Integrated Circuits,” IEEE Transactions on VLSI, Oct, 2006.
  8. K Nowka, G. Carpenter, E. MacDonald, H. Ngo, B. Brock, T. Nguyen.  “A 32-bit PowerPC System-on-a-Chip with Support for Dynamic Voltage and Frequency Scaling,” IEEE Journal of Solid-State Circuits, Vol. 37, No.11, pp. 1441-1447, Nov 2002.

 

Conference and Other Publications

  1. M. Liang; Y. Xiaoju; Shemelya, C.; MacDonald, E.; H. Xin, “3D printed multilayer microstrip line structure with vertical transition toward integrated systems,” Microwave Symposium, 2015 IEEE MTT-S International, pp.1-4, 17-22 May 2015.
  2. M. Liang, C Shemelya, E. MacDonald, R. Wicker, H. Xin, “Fabrication of microwave patch antenna using additive manufacturing technique”, IEEE Radio Science Meeting, 2014.
  3. W. M. Marshall, J. Stegeman, M. Zemba, A. Kwas, E. MacDonald, C. Shemelya, C. Kief, “Using Additive Manufacturing to Print a CubeSat Propulsion System,” AIAA Propulsion and Energy Forum.
  4. C. M. Shemelya, M. Zemba, M. Liang, D. Espalin, C. Kief, H. Xin, E. W. MacDonald, R.B. Wicker, “3D PRINTING MULTI-FUNCTIONALITY: Embedded RF Antennas and Components,” The 9th European Conference on Antennas and Propagation, 2015.
  5. Craig Kief, Jim Aarestad, Eric MacDonald, Corey Shemelya, David Roberson, Ryan Wicker, Andy M. Kwas, Mike Zemba, Keith Avery, Richard Netzer, William Kemp, “Printing Multi-Functionality: Additive Manufacturing for CubeSats,” Proceedings of the AIAA Space 2014 Conference and Exposition, San Diego, CA, August 4-7, 2014.
  6. D. Roberson, C. Shemelya, E. MacDonald, R. Wicker, “Expanding the Applicability of FDM-Type Technologies through Materials Development”, Solid Freeform Fabrication Symposium, August 2014.   One of 12 BEST PAPERs Award at the 25th annual symposium.
  7. A. Kwas, E. MacDonald, C. J. Kief, R. Wicker, C. Soto, L. Bañuelos, J. Aarestad, B. Zufelt, J. D. Stegeman, C. Tolbert, “Printing Multi-Functionality: Additive Manufacturing for CubeSats”, AIAA SPACE 2014 Conference and Exposition, August 2014.
  8. D. Espalin, M.A. Perez, E. MacDonald, R.B. Wicker, “Developing a Multi3D System for Aerospace Components with Embedded Electronics”, Solid Freeform Fabrication Symposium, August 2014.
  9. P.A. Roddy, C.Y. Huang, J. Lyke, J. Baur, M. Durstock, E. MacDonald , “3D Printing for Spacecraft Multi-Functional Structures”, AGU Fall Meeting, 2013
  10. M. Liang, X. Yu, C. Shemelya, D. Roberson, E. MacDonald, R. Wicker and H. Xin, “Electromagnetic materials of artificially controlled properties for 3D printing applications” Antennas and Propagation Society International Symposium, 2014.
  11. M. Liang, C. Shemelya, E. MacDonald, R. Wicker and H. Xin “Fabrication of microwave patch antenna using additive manufacturing technique” Antennas and Propagation Society International Symposium, 2014.
  12. C Shemelya, F Cedillos, E Aguilera, E Maestas, J Ramos, D Espalin, D Muse, R. Wicker E. MacDonald “3D printed capacitive sensors”, IEEE Sensors, 2013, Baltimore MD.
  13. I. Santos, E. MacDonald, “Delay Insensitive logic with Increased Fault Tolerance and Optimized for Subthreshold Operation” IEEE SOI-3D Subthreshold Microelectronics Conference, 2013
  14. D. Zubia, S. Almeida, A. Talukdara, J. Mireles, and E. MacDonald, “SnO2-based memristors and the potential synergies of integrating memristors with MEMS” proceedings of SPIE the international society for optical engineering, Vol. 8373, pp. 52, 2012.
  15. C. Gutierrez, R. Salas, G. Hernandez, D. Muse, R. Olivas, E. MacDonald, M.D. Irwin, R.B. Wicker, K. Church, M. Newton and B. Zufelt, “CubeSat Fabrication through Additive Manufacturing and Micro-Dispensing,” Proceedings from the IMAPS Symposium, Nov. 2011.
  16. A. Chavan, P. Palakurthi, A. Kurian, E. Bozeman, J. Neff, E. MacDonald, “Heavy Ion Characterization of a Novel Radiation Hardened Flip-Flop at Sub- and Super- Threshold Voltage Operation”, IEEE Subthreshold Microelectronics Conference, September 26, 2011.
  17. R. Baca, A. Chavan, M. Alamillo, P. Palakurthi, A. Kurian, E. Bozeman, J. Neff, E. MacDonald, “An Ultra Low Power Subthreshold Sigma Delta DAC”, IEEE Subthreshold Microelectronics Conference, September 26, 2011.
  18. D. Richie, E. MacDonald, M. Markulik, J. Neff, E. Bozeman “Distributed Integrated Circuit Design”, DoD High Performance Computing Modernization Program User’s Group, May 2011.
  19. A. Chavan, Eric MacDonald, Joe Neff, Eric Bozeman “Radiation Hardened Flip-Flop Design for Super and Sub Threshold Voltage Operation”, IEEE Aerospace Conference, March 2011.
  20. R. Olivas, Rudy Salas, Dan Muse, Eric MacDonald, Ryan Wicker, “Structural Electronics through Additive Manufacturing and Micro-Dispensing” IMAPS Nationals Conference, Oct. 2010.
  21. K. Church E. MacDonald, R. Wicker, “Multi-material Micro-stereolithography”, SPIE, Vol. 49, pp. 543-551, 2010.
  22. M. Irwin, E. MacDonald, R. Wicker, “Electronics Embedded into Textiles”, Intelligence Community Post Doc Colloquium, April 2010.
  23. D. Muse, S. Pritchard, E. MacDonald, K. Church, M. Newton, X. Chen R. Wicker, “Improvement of Adhesion and Reliability of Conductive Inks on Flexible Liquid Crystal Polymer Substrates”, International Microelectronic and Packaging Conference, San Francisco, CA November. 2009.
  24. M. Newton, D. Muse, S. Pritchard, E. MacDonald, K. Church, M. Newton, X. Chen R. Wicker, “Direct Print Technology for Fabricating Mechanical Sensors”, International Microelectronic and Packaging Conference, San Francisco, CA November. 2009.
  25. S. Castillo, D. Muse, E. MacDonald, R. Wicker, “Electronics Integration in Conformal Substrates Fabricated with Additive Manufacturing”, Solid Freeform Fabrication Symposium, August 2009.
  26. J.W. Choi, H.C. Kim, E. MacDonald, R. Wicker, “Slice Overlap Detection Algorithm for the Process Planning for Multiple Material Stereolithography”, International Journal of Advanced Manufacturing Technology, in press.
  27. D. Muse, E. MacDonald, K. Church, R. Wicker, “Reliability of Printed Conductors on Liquid Crystal Polymers”, International Microelectronic and Packaging Conference, San Francisco, CA November. 2009.
  28. X. Chen, D. Muse, D. Roberson, M. Alamillo, E. MacDonald, K. Church, R. Wicker, “Direct Printed Technology for Mechanical Strain Gauges”, International Microelectronic and Packaging Conference, San Francisco, CA November. 2009.
  29. K. Church E. MacDonald, Patrick Clark, Frank Medina, Ryan Wicker, “Reliability of Printed Conductors on Flexible Substrates”, Materials Research Society, San Francisco, CA April. 2009.
  30. E. MacDonald, Dan Muse, Misael Navarrete, Frank Medina, Ryan Wicker, “Enhancements to a 3D sensor Fabricated in Solid Freeform Fabrication”, IMAPS Workshop Orlando, Fl, Feb. 2009.
  31. E. MacDonald, session chair, Digital Printing session, IMAPS Workshop Orlando, Fl, Feb. 2009.
  32. E. MacDonald, Ken Church, Patrick Clark, Frank Medina, Ryan Wicker, “Flexible Hybrid Electronics using Direct Printing”, IEEE Flexible Electronics and Displays Conference, Feb. 2009.
  33. E. DeNava, Misael Navarrete, Mohammed Alawneh, Silvia Castillo, Marlene Contreras, Dan Muse, Eric MacDonald and Ryan Wicker, “Three-Dimensional Off-Axis Component Placement and Routing for Electronics Integration using Solid Freeform Fabrication,” 18th Annual Solid Freeform Fabrication Symposium, University of Texas at Austin, August 6-8, 2008.
  34. A. Chavan, E. MacDonald, J. Neff, N. Liu, “A Novel Floating Gate Circuit Family with Subthreshold Swing for Ultra-low Power Operation“, International Symposium on Circuits and Systems, Seattle, May 2008.
  35. E. MacDonald, Ryan Wicker, “Advanced 3D Packaging using Solid Freeform Fabrication” Invited presentation at the Advanced Packaging Workshop, Kirtland Air Force Base, March 2008.
  36. A. Biswas, J. Ferreira-Pinto, E. MacDonald, “Design of a Prototype for a Novel rehabilitative Device for Speech Through Multi-Modal Biomedical Feedback and Control,” Southwest Biomedical Engineering Conference, UTEP, May 2008.
  37. A. Chavan, E. MacDonald,  “Ultra-Low Voltage Level Shifters to Interface Sub and Super Threshold Reconfigurable Logic Cells,” IEEE Aerospace Conference, March 2008.
  38. M. Navarrete, A. Lopes, J. Acuna, R. Estrada, E. MacDonald, J. Palmer, and R. Wicker, “Integrated Layered Manufacturing of a Novel Wireless Motion Sensor System with GPS,” 18th Annual Solid Freeform Fabrication Symposium, University of Texas at Austin, August 6-8, 2007.
  39. C. Robinson, B. Stucker, K. Coperich Branch, J. Palmer, B. Strassner, M. Navarrete A. Lopes, E. MacDonald, Frank Medina, and Ryan Wicker, “Fabrication of a Mini-SAR Antenna Array using Ultrasonic Consolidation and Direct Write,” 2nd International Conference on Rapid Manufacturing, Loughborough University, United Kingdom, July 11-12, 2007.
  40. A. Chavan, G. Dukle, E. MacDonald, B. Graniello (Intel), “Robust Flip-Flop Design for Subthreshold Logic”, Reconfig 2006, IEEE Conference on Reconfigurable Computing, San Luis Potosi, Mexico, Sept. 2006
  41. A. Lopes, M. Navarrete, F. Medina, J. Palmer, E. MacDonald, R. Wicker, “Expanding Rapid Prototyping for Electronic Systems Integration of Arbitrary Form,” Solid Freeform Fabrication Symposium, University of Texas at Austin, August 14-16, 2006.
  42. D. Keymeulen (NASA JPL), I. Ferguson (NASA JPL), E. MacDonald, D. Foor,  “Tuning of MEMS devices using Evolutionary Computation and Open Loop Frequency Response,” IEEE Aerospace Conference, March 2006.
  43. E. MacDonald, S. Starks, S. Blake, “A Solar-Power Design competition to Inspire Interest in Engineering, Science and Mathematics of Pre-College Students” IEEE Aerospace Conference 2006 Conf., Mar. 2006.
  44. B. Graniello, E. MacDonald, “Subthreshold Logic for Temperature-Sensitive MEMS”, TexMEMs 2005 Conference, El Paso, Oct. 2005.
  45. B. Graniello, B. Rodriguez, A. Chavan, E. MacDonald, “Optimized Circuit Styles for Subthreshold Logic”, Electro 2005 Conf., Oct. 2005.
  46. S. Starks, S. Blake and E. MacDonald, “Stimulating Pre-College Interest in Science, Engineering and Mathematics through Space-Oriented Activities,” ASEE Annual Conference, June 2005.
  47. S. Starks, S. Blake and E. MacDonald, “An Overview of Space-Oriented Activities for K-12 Students,” 2005 ASEE-Gulf Southwest Conference, Corpus Christi, TX, March 2005.
  48. K. Joshi, E. MacDonald, “Ripple Scan Clocking for Low Power Test”, VLSI Test Symposium, Monterey, CA, May 2005.
  49. I. Ferguson (NASA JPL), E. MacDonald, D. Foor “Control of a MEMs Gyroscope”, IEEE Aerospace Conference, March 2005.
  50. S. Ghosh, N. Touba, E. MacDonald, “Low-power Weighted Pseudo-random BIST Using Special Scan Cells”, Great Lakes Symposium on VSLI, May 2004.
  51. D. Adams, R. Abbott, X. Bai, Eric MacDonald, “A Integrated Built-In Self Test Solution for Embedded Memories,” Invited Presentation, Memory Design and Test Workshop, , May 2004.
  52. E. MacDonald, N. Touba, “Very Low Voltage Testing of SOI Integrated Circuits”. Proceedings of the VLSI Test Symposium, Apr 25-30, Monterrey, California, April 2002. Also presented in the Latin American Test Workshop in Montevideo, Uruguay Feb 2002.
  53. K. Nowka, G. Carpenter, E. MacDonald, T. Ngo, B. Brock, K. Ishii, T. Burns,   “A Frequency and Voltage Dynamically Scalable Processor”. In the proceedings of IEEE International Solid State Circuits Conference, pp. 480-481, San Francisco, California, February 2002.
  54. E. MacDonald, N. Touba, “Testing Domino Circuits in SOI Technology,” Asian Test Symposium, Taipei, Taiwan, 2001.
  55. E. MacDonald, N. Touba, “Delay Testing SOI Circuits: Challenges with the History Effect,” Proceedings of the International Test Conference, Oct 1999.

 

Invited Presentations

  1. E. MacDonald, panelist “Future of 3D Printing”, E. MacDonald, Space 2.0, Infocast, Santa Clara, CA, September 2015.
  2. E. MacDonald, “3D Printing Multifunctionality”, Universidad de Talca, Curicó, Chile, August 3.
  3. E. MacDonald, “3D Printing Multifunctionality”, Universidad de Terapacá, Arica, Chile, June 28th. (Cancelled due to Chilean miner’s strike in Calama).
  4. E. MacDonald, “3D Printing Multifunctionality”, Universidad de Concepción, Concepción, Chile, June 28th.
  5. E. MacDonald, “3D Printing Multifunctionality”, Universidad Técnica Federico Santa María, Chile, June 12.
  6. E. MacDonald, “3D Printing Research Overview of the University of Texas at El Paso”, Northrop Grumman, Space Park, LA, CA, April 8, 2015.
  7. E. MacDonald, panelist“Frontiers in 3D Printing”, Additive Disruption, Infocast, San Jose, CA, March 8, 2015.
  8. E. MacDonald, “3D Printing Multi-Functionality”, United Technologies Corporation (UTC) Additive Manufacturing Conference, Hartford, Connecticut, September, 2014.
  9. E. MacDonald, “3D Printing Multi-Functionality: America Makes investment”, KITECH 3D Printing International Forum, Taegu, South Korea, July, 2014.
  10. E. MacDonald, “3D Printing Multi-Functionality: Mechanical Structures with Electronics”, First Annual BITS Conference 2014, Dalian, People’s Republic of China, June 2014.
  11. E. MacDonald, “Panel on Additive Manufacturing for Automotive Applications” MainForum 2014, Monterrey, Mexico, March 2014.
  12. E. MacDonald, “Panel on Additive Manufacturing for Aerospace Applications” American Institute of Aeronautics and Astronautics ScienceTech 2014, Maryland, January 2014.
  13. E. MacDonald, “3D Printing of Multi Functional Structures” IEEE Mexico, Saltillo, Mexico, November 2013.
  14. E. MacDonald, “Printing Multi-Functionality: Structural with Electronics” Kirtland AFB, Albuquerque, August 2013.
  15. E. MacDonald, “Texas Instruments Technology in 3D Printed Structural Electronics at the University of Texas at El Paso”, Texas Instruments’ Analog Design Summit, Dallas Texas, July 2013.
  16. E. MacDonald, “Invited Lecture on Additive Manufacturing”, MIGAS Doctoral Summer School, Grenoble France, July 2010.
  17. E. MacDonald, “Advanced 3D and Flexible Packaging” Invited presentation at a colloquium in the Department of Electrical and Computer Engineering, New Mexico State University, Las Cruces, New Mexico, April 2008.